On May 8, 2026, the Suzhou International Conference Hotel hosted the grand opening of the "5th Data Center & AI Chip Liquid Cooling Technology Summit and Exhibition 2026." This summit emerged in response to the new landscape where artificial intelligence is reshaping global industries at an unprecedented pace. Its goal is to promote the in-depth application and large-scale deployment of liquid cooling technology in data centers and AI chips.

Mingshi Xingxin has long planned ahead, seizing early opportunities and positioning itself firmly in this field. Several years ago, the company began exploring and implementing targeted materials, processes, and technologies to customize liquid cooling piping systems. It has since successfully served major domestic cloud service providers such as Alibaba, Tencent, Huawei, and GDS, as well as numerous large-scale energy storage projects.

The company's delegation to the exhibition was personally led by President Yitong. As a core supplier of liquid cooling systems for data centers, Mingshi Xingxin approaches the event with a mindset of learning and exchange. We are eager to join peers in embracing the new era, seizing new opportunities, sharing new technologies, and exploring new developments together. We aim to contribute ideas and strength to the chilling wisdom of liquid cooling—the "Ice Soul"—so as to serve the construction of a Digital China and a new energy system more actively and effectively.